Meta is seeking an experienced Silicon Packaging Engineer to join the Ecosystem and Technical Operation team. The role requires prioritizing competing workstreams across a cross-functional environment and driving hardware development for AI/HPC systems from concept to production.
Key expertise includes flip chip, 2.5D/3D packaging, interposer and fanout designs, and the ability to develop manufacturing specifications, qualify vendors, and improve costs and efficiencies while collaborating with
#J-18808-LjbffrSenior Silicon Packaging Engineer for AI/ML HPC in sunnyvale at Unknown Company
This position is listed as full time and onsite.