Senior Silicon Packaging Architect – Advanced 3DIC

Synopsys, Inc. is seeking an experienced hardware engineering professional specializing in advanced silicon package design.

You will lead cross-functional efforts to optimize SIPI performance, including bump mapping and power estimation, and develop interposers and RDL fanout packages for high-performance silicon solutions. You will model, simulate, and validate electrical, thermal, and mechanical aspects while collaborating with global teams and customers to drive innovation in packaging