Micron Technology in Richardson, TX is seeking a Sr Design Engineer to design, simulate, and validate next‑generation High‑Bandwidth Memory (HBM) architectures and DRAM blocks. You will collaborate with global design teams to optimize timing, power, and reliability for AI/ML, HPC, and graphics applications.
You will participate in tape‑out activities, ECOs, and verification using industry tools, ensuring manufacturability and quality across complex 3D-stacked memory systems.
#J-18808-LjbffrSenior HBM Design Engineer: 3D-Stacked Memory & HPC in richardson at Unknown Company
This position is listed as full time and onsite.