Senior Design Engineer, HBM & 3D-Stacked Memory

Micron Technology, Inc. seeks a Sr Design Engineer to design, simulate, and validate next‑generation High‑Bandwidth Memory architectures and blocks.

You will collaborate with global teams to optimize manufacturing functions, cost, quality, and time‑to‑market across AI/HPC and graphics products. The role requires MS in CE or related field, 3+ years DRAM design/verification experience, and strong skills in HBM, high-speed I/O, PHY timing, and verification flow.