Process Development EngineerExperience Level: Professional Job Type: Regular Location: Richardson, TX, US, 75080 Responsibilities: Develop and optimize SMT, semiconductor packaging, and advanced assembly processes. Support both volume production as well as New Product Introduction (NPI) production. Support manufacturing for surface mount electronics (SMT), Flip Chip Attach and Die Attach.
Lead process characterization, DOE execution, and process window development Evaluate new equipment, processes, and materials. Generating post build/DFM report. Take 5S/process improvement initiatives.
Monitor Product Yields daily and work with appropriate engineers to take corrective actions. Work with Fixturing vendors to design and support assembly in the factory. Mentor technicians and operators on process control and best practices.
Develop process documentation, work instructions, control plans, and manufacturing standards.Qualifications: BS in Mechanical, Electrical, Manufacturing, Material engineering degree or related discipline; MS degree preferred. 2+ years industry experience required or postgraduate degree accepted in lieu of industry experience Relevant industry internship experience desired. Strong Semiconductor Assembly experience with High density of fine pitch components – BGA, LGA, QFN, 0201, 01005 components, etc 1-2 years of experience in a mid to high-volume manufacturing environment preferred Experience with reflow, pick and place and solder paste printing is preferred Experience with SPC techniques and Lean practices is preferred Knowledge of IPC-A-610 standard preferred Desired Skills: Strong technical leadership Excellent communication skills Project management capability Cross-functional collaboration Continuous improvement mindset This position is not eligible for visa sponsorship by the Company.