Micron Technology, Inc. is seeking a Principal Engineer to lead HIG-HBM design efforts, crafting high-speed memory paths from I/O to core. You will simulate, optimize, and floor plan DRAM circuits, partnering across global teams to ensure top performance, power efficiency, and reliability.
Expect innovation across front-end and backend processes to deliver lowest power per bit solutions. You will drive front-end/back-end integration, work on test plans, and qualify designs to meet stringent
#J-18808-LjbffrPrincipal HBM Design Engineer — High-Speed Memory in richardson at Unknown Company
This position is listed as full time and onsite.