Micron Technology is seeking an experienced physical design engineer to drive end-to-end HBM base die development. You will own floorplanning, power planning, placement, and signoff for high-density memory designs and collaborate across memory, PHY, RTL, and packaging teams to optimize bandwidth, latency, power and yield.
The ideal candidate has 7+ years in advanced-node physical design, with tape-out experience on memory designs and strong expertise in PDN, IR/EM, and timing closure.
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