Micron Technology, Inc. seeks a senior physical design engineer to drive end-to-end PD for HBM base dies and memory dies, from netlist through GDSII, owning floorplanning, PDN, and signoff for high-density designs.
You will define HBM-specific architecture, optimize bandwidth and power, and lead ECOs, sprinting toward tape-out readiness with AI-assisted flows. Relevant HBM/DRAM experience required.
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