Be VisionaryTeledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.Job DescriptionUnder the supervision of the Detector Yield and Integration Engineering Manager, the individual in this position will be responsible for improving product yield and ensuring manufacturing efficiency across advanced technology production lines. This role involves the collection, tracking, and analysis of process and metrology data from a variety of sources to inform and guide the team's design and yield improvement activities. A significant aspect of this position also includes direct involvement in device failure analysis, identifying root causes of defects, and implementing corrective actions to optimize performance and reliability.The individual will need to work effectively in a high-performance team environment collaborating with multiple contributors across the spectrum of relevant engineering and operational disciplines.
Must demonstrate strong interpersonal and communication skills. A flexible, self-motivated, results oriented mindset is essential.The ideal candidate will have the following experience:Monitor wafer and die yield performance using SPC and MES systemsAnalyze electrical test data and defect density trends using JMP, Python, MATLAB or similarSQL database query experienceGenerate yield dashboards and reports for management and engineering teamsStructured problem-solving methods (Kepner Tregoe, DMAIC, 8D, 6-sigma, etc.)Design of experiments (DOE / ANOVA)Optical microscopySEM / FIB / EDXProfilometry, ellipsometryElemental analysis methodsFault isolation techniquesSemiconductor wafer processing (photolithography, etch, deposition, surface clean, CMP, inspection, etc.)Vacuum technologyInfrared imagingHermetic packagingB.S. in engineering or science, M. S.
preferred2+ years experience as a Process, Manufacturing, Quality, or Design EngineerMust be US Citizen or Perm ResidentWhat We Offer:Competitive Salary & Benefits PackageHealth, Dental, Vision, and Life Insurance from Day 1Paid Vacation, Sick Time, and Holidays401(k) with Company MatchEmployee Stock Purchase PlanEducational Tuition ReimbursementFun Employee Events throughout the yearSalary Range: $113,600.00-$151,400.000The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.Teledyne is an Equal Opportunity Employer.
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.