Thermo-Mechanical Engineer – Boston, MA (Onsite)
I'm currently hiring for an early-stage semiconductor startup developing next-generation 3D heterogeneous integration technology. They're building advanced semiconductor systems that combine silicon, III-V materials and novel interposers into a single package, targeting applications across defense, aerospace, power electronics and future AI compute infrastructure.
They're looking for an experienced Thermo-Mechanical Engineer who enjoys taking ownership of complex engineering challenges from first principles. This is a rare opportunity to join as a founding engineer, lead thermal and mechanical design from day one, and develop the simulation and reliability methodologies that will underpin an entirely new semiconductor integration platform.
What they're looking for:
- PhD with 2+ years or MS with 5+ years of relevant experience, or equivalent practical experience
- Strong experience with thermal and structural FEA using ANSYS, COMSOL, Icepak or similar tools
- Experience with advanced semiconductor packaging, heterogeneous integration or 3D stacked die
- Strong understanding of thermal management, mechanical stress, warpage and reliability
- Hands-on experience with thermal measurement, validation or advanced cooling technologies
- Experience with package-level simulations, microbump fatigue or die-attach reliability is a strong plus
Important details:
- Fully onsite in Boston, MA
- $150K–$220K base + founding-team equity
Thermal Engineer in ma at Unknown Company
This position is listed as full time and onsite.