Annapurna Labs in Amazon's data center division seeks a Sr. Thermal & Mechanical Packaging Engineer to lead the design and optimization of high-volume semiconductor packaging for our world-scale computing infrastructure.
You will develop from the lowest circuit levels to full system designs, applying CFD/FEA methods and collaborating with vendors and internal teams to improve performance, reliability, and cost across AWS deployments.
#J-18808-LjbffrThermal & Mechanical Packaging Engineer - Data Center in austin at Unknown Company
This position is listed as full time and onsite.