SiMa.ai, Inc. seeks a Technical Director of Packaging Engineering in San Jose, CA to lead high-speed packaging development for LPDDR5x/6, PCIe Gen5, and related interfaces.
You will own SI/PI design, lab correlation, and supplier relationships, driving architecture through mass production with a focus on cost, quality, and reliability. The role requires hands-on experience with advanced substrates, 2.5D/Chiplet concepts, and cross-functional leadership across Design, Hardware, and QA teams.
#J-18808-LjbffrTechnical Director, High-Speed Packaging & SiP in san jose at Unknown Company
This position is listed as full time and onsite.