Apple is seeking a senior hardware packaging engineer to own and drive sophisticated package substrate development, roadmaps, and architecture optimization. You will coordinate with substrate manufacturers, foundries, and OSAT partners to bring solutions from concept to high-volume manufacturing.
Ideal candidates bring MS/PhD level fundamentals in materials or mechanical engineering, hands-on substrate manufacturing experience, and proficiency with Cadence Allegro for design reviews and
#J-18808-LjbffrSubstrate Technology Lead: Packaging & Innovation in irvine at Unknown Company
This position is listed as full time and onsite.