Syenta Job OpportunitySyenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Manufacturing (LEM) technology. Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool. We do that by achieving high-speed, high-resolution metallization at significantly lower costs and energy use, while minimizing emissions and waste.Founded in Australia, our growing footprint in the US represents a key milestone in our journey.
We are building a world-class team where seasoned engineers and ambitious emerging talent collaborate to solve some of the toughest challenges in semiconductor manufacturing.About the RoleThis role is a critical addition to Syenta's technical capabilities, enabling in-house design of advanced substrate IC packages and multi-layered interposers. You will play a foundational role in developing designs that underpin next-generation packaging architectures, including high-performance chip-to-chip integration approaches.Working at the intersection of electrical, thermal, and mechanical design, you will lead the development of complex substrate layouts that directly enable fabrication and deployment of our platform.This is a highly technical, hands-on role with immediate impact, where your work will directly unlock fabrication and influence the future direction of our technology.ResponsibilitiesSubstrate & Interposer DesignDesign large (>50mm), complex multi-layer substrate interposers with high pin counts and dense routing requirementsDevelop high-speed signal routing solutions capable of supporting >50GHz performance while minimizing signal integrity issues such as loss and crosstalkEnsure robust signal integrity (SI) and power integrity (PI) across all designsOptimize designs for thermal performance and reliabilityDesign Validation & DocumentationPerform DRC (Design Rule Check) and LVS (Layout vs. Schematic) verification for all substrate designsDevelop and maintain detailed design documentation, specifications, and reusable guidelines for future interposer and substrate developmentCross-Functional CollaborationWork closely with global, cross-functional teams across engineering disciplines to ensure design feasibility, manufacturability, and performancePartner with process, materials, and hardware teams to align design with fabrication capabilities and constraintsTechnical Leadership & DevelopmentContribute to the establishment of internal best practices for substrate and interposer designProvide expertise in advanced packaging design, helping build this capability within SyentaRequirementsBachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field5+ years of experience in substrate IC package design for high-performance processors or acceleratorsExtensive experience designing large-format substrate packages (>50mm) with complex, high-density layoutsDeep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatchesAdvanced proficiency in Allegro Package Designer (constraint management, routing, and design verification)Strong understanding of SI/PI principles and their application to package-level designSolid foundational knowledge across electrical, materials, thermal, and/or mechanical engineering disciplinesWorking knowledge of substrate manufacturing processes, design rules, and material propertiesStrong analytical and problem-solving skills, with the ability to operate effectively in a fast-paced, cross-functional environmentPreferred QualificationsFamiliarity with Valor CAM350 or Calibre for package design reviewsExperience designing for advanced packaging architectures (e.g.
multi-chip modules, interposers, or similar high-density systems)Experience working in high-growth or startup environmentsWhy Choose Syenta?We're passionate about building a diverse, people-first company. We believe that our culture of collaboration and mutual respect fuels the kind of innovation that can redefine an industry.What We OfferSalary Range: US $130k – $160k (negotiable)Early-stage equity opportunitiesPotential 401(k) and other benefitsComprehensive health, dental, and vision coverage plans, supported by CompanyProfessional Growth – We're scaling fast, so responsibilities can expand significantly in tandem with the businessTeam Events – Annual company event in Australia to collaborate and celebrateWork-Life Balance – Flexible leave policies and an understanding that meaningful work can coexist with a fulfilling personal life15 days PTO and 10 days sick leaveSyenta is an Equal Opportunity Employer. We do not discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, age, or any other characteristic protected by law.