Renesas Electronics Corporation in Tempe, AZ (or Austin, TX) seeks a Staff Package Design Engineer to advance high-performance semiconductor package solutions including power modules, FCBGA, SiP, WLCSP, and multi-die architectures. You will collaborate with silicon design, SI/PI, thermal, reliability, and manufacturing teams to ensure robust, manufacturable designs.
The role emphasizes package layout execution, DFM/DFA adherence, and cross-domain co-design across global engineering teams to
#J-18808-LjbffrStaff Package Design Engineer: Multi-Chip & Power Modules in tempe at Unknown Company
This position is listed as full time and onsite.