Staff Equipment Development EngineerMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Position Overview: As a Staff Equipment Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you will develop and optimize next-generation, first-of-a-kind (FAOK) wafer and die equipment. You will take ideas from conception through development to implementation in APTD and manufacturing facilities.
Responsibilities include identifying, diagnosing, and resolving equipment-related problems using failure analysis, FMEA, 8D, or FDC/Data Science methodology. You will also coordinate and carry out equipment evaluation/optimization, lead improvement and cost reduction activities, and interact with process development, manufacturing, and equipment vendors to ensure robust processes. You will become a domain expert, crafting technology roadmaps and influencing Micron's leadership in semiconductor manufacturing.Responsibilities:Develop strategies and implement to improve equipment maturity for (FOAK) hardware.Develop hardware roadmaps for 5+ years in the area of post probe wafer and die processing. Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron's products.Optimizing equipment to reduce cost, increase availability, and improve hardware and process capability.Collaborating with process development teams to develop innovative new solutions.Conducting root cause and failure mode analysis to understand the limitations of current hardware and drive APTD development projects with OEMs vendors for solutions.Performing fundamental research to drive innovative solutions for next-generation equipment products.Support equipment transfer to production facilities (some domestic or international travel may be required).Minimum Qualifications:Master's Degree or equivalent experience in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields2+ years of semiconductor process or equipment engineering experienceFundamental understanding of post probe and assembly process and equipment interactions.Understanding of related inline/electrical/probe failure.2+ years of experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysisAbility to resolve sophisticated issues through root-cause or model-based problem solving and a focus on meeting commitmentsHands on experience with wafer / assembly tools and overlay systemsPreferred Qualifications:Ph.D. in Mechanical Engineering, Chemical Engineering, Electrical Engineering, or a related technical field, or equivalent experienceKnowledge of robotics, machine logic language, or new hardware design is desirable.Wafer or die bonding, plating, warpage control and packaging field experience preferable.Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.