Senior Or Staff Engineer, Dry Etch R&DMicron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands?on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production?ready solutions. Our work sits at the intersection of innovation, scale, and real?world impact—and collaboration is how we win.Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation.
As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma?based etch processes that enable next?generation packaging technologies. This role offers deep technical ownership, broad cross?functional collaboration, and the opportunity to influence long?term technology roadmaps from early research through high?volume manufacturing.Responsibilities:Develop and optimize dry etch process modules to meet performance, yield, and reliability requirements for advanced packaging productsDrive process capability, cost, and variability improvements using data?driven experimentation and equipment innovationCollaborate closely with process integration and adjacent process teams including Wet Etch, Films, Lithography, CMP, Wafer Trim, and BondingPerform root?cause and failure?mode analysis and partner with equipment vendors to resolve complex process and hardware challengesSupport global process transfer and readiness for high?volume manufacturing, including occasional international travelMinimum Qualifications:Bachelor's degree in Chemical, Mechanical, Electrical, Materials Science, Physics, Chemistry, Semiconductor Engineering, or related field with 5+ years of relevant dry etch experienceOR Master's or PhD in a related discipline with 3+ years of relevant dry etch experience in the semiconductor industryDemonstrated hands?on R&D experience advancing process performance through structured experimentationProven ability to apply DOE, data analysis, and first?principles reasoning to complex process problemsAbility to work independently while managing multiple technical priorities and program commitmentsPreferred Qualifications:Deep expertise in plasma etch processes and plasma–material interactions for advanced patterningExperience influencing technology direction, integration strategies, or long?term process roadmapsExposure to advanced packaging technologies such as TSV, RDL, hybrid bonding, or 2.5D/3D integrationProficiency in statistical process control and variability reduction methodologiesFamiliarity with Python, data automation, or GenAI?enabled analysis for process developmentMicron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.