Micron Technology seeks an experienced R&D engineer to advance wafer edge trim, backgrind and thinning processes for next-gen memory products. You will collaborate with process integration and adjacent areas to meet performance and yield targets, while solving complex mechanical and material challenges.
The role emphasizes experimental design (DOE), data analysis, and scalable solutions with strong ownership and independent work ability.
#J-18808-LjbffrStaff Engineer, Advanced Packaging: Wafer Edge Trim & Backgrind in boise at Unknown Company
This position is listed as full time and onsite.