Navitas Semiconductor seeks a Staff Electromechanical Packaging Engineer in Torrance, CA. You will contribute to chip-scale packaging design, HDI substrates, and cross-functional collaboration with layout, ASIC design, and manufacturing teams.
The role requires a BS in mechanical or electrical engineering, 3+ years in microelectronics packaging or PCB design, and familiarity with CAD tools and thermal analysis.
#J-18808-LjbffrStaff Chip-Scale Packaging Engineer (GaN/SiC) in torrance at Unknown Company
This position is listed as full time and onsite.