Software EngineerApplied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.As a Software Engineer at Applied Materials, you'll dive deep into ground-breaking technologies—like machine learning and AI—to craft novel software solutions that solve our customers' high-value problems.
Our Software Engineers are responsible for designing, prototyping, developing, and debugging software solutions for semiconductor equipment components and devices to ensure quality and functionality. You'll develop software documentation and test procedures, troubleshoot software problems, and communicate with internal customers to understand project requirements. As part of our team, you'll contribute your expertise in intricate systems, deciphering code, and anticipating software behaviors to ensure Applied remains the leader in the semiconductor and display sectors.About the RoleWe are seeking a highly capable and driven Software Engineer with a strong instrumentation background to serve as the Technical Lead for the Software Platform of our wafer processing tool. In this role, you will architect, implement, and deliver the full software stack that controls a subsystem and integrates it into the main system.
You will work cross functionally with mechanical, electrical, and supplier teams to deliver a production ready solution under aggressive timelines. This is a high-ownership, high-impact role for someone who wants to lead a major subsystem from concept through release.Key ResponsibilitiesFull-Stack Software OwnershipDesign and implement all software components required for equipment control, including:Chamber subsystems (motion, sensors, safety, I/O)Wafer handling coordinationRecipe interface and execution logicAPI and communication interfaces to the main frame of semiconductor processing equipmentBuild a complete standalone subsystem software framework capable of operating independently and integrating tightly with the main system.2. Architecture & InfrastructureArchitect software running on a dedicated subsystem server, including:Real?time communication over EtherCAT portIntegration with safety circuits provided by vendorsImplement robust, maintainable APIs for communication with the main framework.Implement reliable communication channels including but not limited to:Device synchronizationRecipe handlingError and safety signalingWafer handling coordinationData transferSystem status monitor and logging3. Supplier CollaborationAct as the primary software technical contact for suppliers and coordinate engineering efforts with suppliers' software teamProduce high quality architecture documents, interface specifications, and integration guides.4.
Technical LeadershipServe as the software technical lead for the team:Shape and drive design decisions across ME, EE, and SWEstablish software standards, architecture direction, and code qualityCoordinate integration with system engineeringMentor and support other contributorsWork closely with Mechanical Engineering and Electrical Engineering teams, who will remain dedicated partners throughout the project.Preferred QualificationsMS+ in Electrical Engineering, Physics, Biomedical Engineering, Optical Engineering, Computer Science or related disciplines.5+ years hands-on experience with instrumentationMastery on C#, modern C++ and PythonProduction level experience with EtherCAT, motion control and configuring safety logicsExtensive software architecture design and project management skillsAbility to collaborate effectively with cross-functional engineering groupsExperience in the field of semiconductor/automation equipment control or roboticsFamiliarity with optical imaging systemsFamiliarity with FPGA programmingAdditional InformationTime Type: Full timeEmployee Type: Assignee / RegularTravel: Not SpecifiedRelocation Eligible: YesThe salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.