SoC Physical Integration Engineer — FPGA/ACAP

Advanced Micro Devices, Inc. (AMD) is seeking a highly skilled SoC Physical Integration engineer in San Jose, CA to contribute to chip-level integration and tape-out of FPGA/ACAP devices.

You will work across Architecture, CAD, Software, and Product Engineering to deliver robust physical implementations. Responsibilities include developing flows, improving verification tooling, and coordinating across design teams to enable seamless integration in cutting-edge 2nm/3nm nodes and 2.5D/3D