- responsible for the development and qualification of advanced packaging solutions for Cisco’s next generation optical transceiver products
- serve as the primary technical interface for the Client Optics Group with top-tier Outsourced Semiconductor Assembly & Test (OSAT)
- lead the design and layout of test vehicles to validate packaging processes
- conduct rigorous design reviews for complex substrates, ensuring alignment with signal/power integrity requirements and manufacturing capabilities
- cross-functional technical leadership to proactively identify and mitigate risks, resolve highly complex assembly issues, and establish best-in-class quality and reliability standards across the supply chain
- work collaboratively with other internal teams to influence package architecture and provide expert guidance on DfM, DfR
- engage deeply in substrate design, materials selection, and reviews
- present technical findings and recommendations to cross-functional teams and stakeholders
- stay informed on emerging packaging technologies and industry trends
Requirements
- Masters Degree in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field with 8+ years of experience in Photonics or Semiconductor Packaging Industry or a PhD in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field with 3+ years of experience in Photonics or Semiconductor Packaging Industry
- Proven experience in advanced Silicon Photonic package technology development, such as 2.5D/3D integration, TSV, flip-chip, stacking, hybrid integration, wafer-level packaging, and package technology qualification methods
- Prior experience of package design & architecture, including substrate design and chip fabrication
- Experience with advanced substrate manufacturing processes and materials and their impacts to device level signal and power integrity
- Experience with industry-standard design and simulation software (e.g., Cadence, klayout, Ansys or similar tools)
Core Competencies
Demonstrates expertise in advanced packaging solutions for optical transceivers, with a strong focus on Silicon Photonic package technology development and substrate design. Proven ability to lead cross-functional teams, conduct rigorous design reviews, and influence package architecture while ensuring quality and reliability standards.
Highest-signal resume keywords
- Advanced Silicon Photonic Package Technology Development
- Substrate Design & Architecture
- Design & Simulation Software (Cadence, Klayout, Ansys)
- Cross-Functional Technical Leadership
- Risk Mitigation & Quality Assurance
ATS Optimization Keywords
Hard Skills
- Silicon Photonic Package Technology
- 2.5D/3D Integration
- TSV
- Flip-Chip
- Stacking
- Hybrid Integration
- Wafer-Level Packaging
- Package Technology Qualification Methods
- Advanced Substrate Manufacturing Processes
- Signal/Power Integrity
Soft Skills
- Technical Communication
- Collaboration
- Problem Solving
- Leadership
Industry Keywords
- Photonics
- Semiconductor Packaging
- Design for Manufacturing (DfM)
- Design for Reliability (DfR)
Tools & Technologies
- Cadence
- Klayout
- Ansys