Intel seeks an experienced LYA Engineer for back-end package and wafer-level assembly analysis in Hillsboro, Oregon. You will design, test, and characterize assembly technologies, bridging between engineers, technicians, and customers.
Expect hands-on lab work, data-driven failure analysis, and cross-functional collaboration to identify root causes and drive improvements. The role emphasizes program priorities, effective communication, and a willingness to work across teams in a fast-paced
#J-18808-LjbffrShift Wafer Yield Engineer — Failure Analysis & Root Cause in hillsboro at Unknown Company
This position is listed as full time and onsite.