Senior Yield & Integration EngineerTeledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.Job Summary:Under the general supervision of the Yield & Integration Engineering Manager, the Senior Yield & Integration Engineer is a technical leader responsible for driving yield improvement, process integration robustness, and defectivity reduction across advanced IR detection and thermal imaging device manufacturing operations. This role provides deep expertise in yield analysis, failure analysis, and progressed materials characterization, while leading cross-functional teams through complex yield excursion investigation, technology transfer, and new product introductions (NPI).The individual will need to exhibit a self-driven sense of urgency, effective collaboration, tolerance of ambiguity, and demonstrated ability to exercise objective technical judgement while embracing the following responsibilities:Yield Ownership & Defectivity Reduction Oversee wafer foundry yield management by establishing yield monitoring frameworks, analyzing inline, parametric, and final test data to identify yield loss mechanismsLead root cause investigations into yield excursions across fabrication, assembly, and testCollaborate closely with foundry partners and internal process integration, device, and reliability teams to drive corrective actions, optimize process windows, and deliver sustained yield improvement and cost reductionAdvanced Failure Analysis & Characterization Analyze yield loss mechanisms impacting key detector metricsDrive root cause analysis using advanced tools and techniquesCorrelate physical defects to electrical, thermal, and optical performance impactProcess Integration – IR & Bolometer Technologies Own and optimize integrated process flowsEnsure compatibility and robustness across front-end, MEMS, and back-end processesSupport technology transfers and manufacturing ramp of new IR detector designsData Analytics & Performance Correlation Correlate process data with thermal imaging performance metrics and test resultsPerform advanced yield and performance analysis using JMP, Python, SQL, or MATLABDevelop yield dashboards, defect Pareto analyses, and predictive indicators for yield riskCross-Functional Technical Leadership Partner closely with device design and modeling teams, ROIC and electronics engineering,Interact reliability, packaging, and test engineeringInterface with equipment vendors, material suppliers, and external foundries on yield and integration issuesSupport customer-facing root cause investigations and continuous improvement effortsMentorship & Continuous Improvement Mentor junior yield and integration engineers in IR-specific failure analysis and yield methodologiesLead multi-disciplinary improvement projects using Lean and Six Sigma toolsDefine best practices, documentation standards, and yield control plans for manufacturingThe ideal candidate will have the following:Technical Expertise Familiarity with electronic circuit functionality (schematics, functional elements, etc.)Microbolometer MEMS fabricationInsight to wafer foundry functionality and process integrationVacuum technology: concepts, materials, and equipmentFamiliarity with photolithography processes and equipmentROIC-to-detector hybridizationWafer bonding, dicing, and release stepsStrong understanding of MEMS processing, thin films, and wafer-level integration PhotolithographyWafer photo pattern strips & cleansCMP, Etch, Lift-offPECVD, PVD, E-BeamExpertise in SPC, DOE, and yield analyticsHands-on experience with AOI, SEM, EDX, FIB, FTIRSkills Strong data-driven decision-making and mentorship capabilitiesExceptional root cause analysis and system-level thinkingStrong written and verbal communicationAbility to lead technically across organizations without direct authorityRequired QualificationsM.S.
or equivalent in a STEM field- Will consider work equivalent work experience.7+ years of experience in yield engineering, process integration, or device engineeringDirect experience with infrared detectors, thermal imaging systems, microbolometers, or MEMS devicesMust be US Citizen or PERM ResidentPreferred QualificationsFamiliarity with vacuum packaging, wafer bonding, and hermetic sealingPrior ownership of an IR technology node or product familySix Sigma Green Belt or Black Belt certificationSalary Range:$141,900.00-$189,200.000The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, local regulations (such as minimum wage), education/training, work experience, key skills, and type of position.Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders.
Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.Teledyne is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws.