Micron Technology is seeking a Staff/Principal Wafer Bonding Process Engineer in Boise, Idaho, to develop and optimize wafer bonding processes for next-generation DRAM technologies. You will lead DOE studies, drive yield and cost improvements, and collaborate across manufacturing and suppliers to implement robust process solutions.
Ideal candidates have advanced degree and extensive experience in bonding technologies, data analytics, and innovative problem solving.
#J-18808-LjbffrSenior Wafer Bonding Process Engineer - DRAM and AI-Driven in boise at Unknown Company
This position is listed as full time and onsite.