Senior TPM: Multi-Die ML Accelerator Chip Program

Annapurna Labs is seeking a Principal Technical Program Manager to own end-to-end program execution for a multi-die chip. This role connects RTL, DV, physical design, packaging, power, and infrastructure into a single coherent schedule and drives cross-functional decisions to keep the program on track.

The successful candidate will manage external design partners, track verification convergence, and coordinate IP deliveries across teams to achieve production readiness.