Intel Corporation in Phoenix, AZ is seeking a Thermal Analysis Engineer to drive research on advanced semiconductor devices, packages, and interconnects. You will design, fabricate, and test prototypes, applying device physics and thermomechanical analysis to optimize performance and cost.
The role requires hands-on experimentation, collaboration across device, reliability, and fabrication teams, and expertise in DOE, simulations (Ansys/Abaqus), and programming (Python/MATLAB).
#J-18808-LjbffrSenior Thermal & Packaging Research Engineer in northern at Unknown Company
This position is listed as full time and onsite.