Founded in 2016 and listed on the Hong Kong Stock Exchange (HKEX: 2533), Black Sesame Technologies is a leading provider of AI system-on-chip solutions. Our mass-produced AI chips are deployed across the automotive and robotics markets, delivering high-performance, automotive-grade computing solutions at scale. As we develop our next generation of AI inference accelerators, we are rapidly expanding our R&D teams in Singapore and the United States. Join us and help build the foundational technologies powering the future of intelligent machines.
Responsibilities
- 1. Develope micro-architecture for High Speed IO design
- 2. RTL design, verification and integration
- 3. Synthesis and optimize for timing, area and power
- 4. Module and top-level documentation
- 5. Work with architecture and software teams to develop next-generation silicon.
Basic Qualifications
- 1. Master's degree and above in Electrical/Electronics/Computer Engineering， 5+ years experience.
- 2. Fluent with HDL languages(Verilog, SystemVerilog)
- 3. Experience in High Speed IO such as PCIE, Die to Die, Chip to Chip, Ethernet and etc
- 4. Familiar with software languages C/C++
Senior/Staff Engineer, ASIC Design in san jose at Unknown Company
This position is listed as full time and onsite.