Apple Inc. is seeking a seasoned Substrate Packaging Engineer to lead SoC package substrate technology development and roadmap definition. You will collaborate with foundries, OSATs, and cross-functional teams to bring substrate solutions from concept to high-volume manufacturing.
The role requires hands-on experience in substrate manufacturing, strong project management skills, and familiarity with Cadence Allegro. A BS with extensive experience is essential, with advanced degrees preferred.
#J-18808-LjbffrSenior SoC Packaging Substrate Engineer, Roadmap Focus in austin at Unknown Company
This position is listed as full time and onsite.