We are seeking a Senior SoC/ASIC Physical Design Engineer to drive physical design activities to successful closure by collaborating closely with RTL and cross-functional engineering teams.
In this role, you will develop, refine, and implement cutting-edge flows and methodologies that optimize performance, power, and area (PPA), directly contributing to world class time to closure and tapeout with optimal team efficiency and resource allocation.
Responsibilities:
- Build modern physical design flows using EDA tool fusion and machine learning to optimize PPA, resources, and accelerate time-to-closure.
- Perform synthesis, floorplanning, PDN generation, place & route, timing, noise, verification, EM/IR checks, and signoff.
- Create and refine PD methodologies and automation scripts to streamline design and signoff processes.
- Partner with RTL, DFT, and ASIC teams to define architectural feasibility, timing/power/area targets, and design trade-offs.
- Apply a metrics-driven approach to resolve design and timing challenges and ensure predictable milestone delivery.
- Lead closure activities, including STA, noise analysis, logic equivalency, physical verification, and power integrity (EM/IR).
Qualifications:
- Bachelor’s in Electrical Engineering, Computer Engineering, or Computer Science .Master’s preferred
- At least 10 years of experience in ASIC/SoC physical design and flow development.
- Expertise in RTL-to-GDSII design flows, Synopsys EDA tools, and advanced PD methodologies like synthesis, place & route, STA, CDC, power analysis.
- Knowledge of FinFET/deep sub-micron CMOS, DFT methodologies like Scan, MBIST, LBIST and power/IR drop management.
- Strong ability to analyze design parameters and QoR metrics and implement advanced power optimization techniques such as SVS, DVFS, and SRAM split-rail architectures.
- Proficient in Python, Tcl, Perl, bash/csh, and automation scripting.
- Strong analytical and problem solving skills with proven ability to lead design closure and collaborate across teams.