Amazon in Austin, TX is seeking a Senior Manager of Package Signal & Power Integrity to lead a focused SI/PI team and set the technical direction for 2.5D/3D packaging. You will drive PDN/PI strategies across die-to-die interfaces and high-speed SerDes, while staying hands-on with modeling and post-silicon correlation.
You will partner with silicon design, OSATs, substrate teams, and system architects to ensure robust signaling and power delivery for next-generation chiplet products.
#J-18808-LjbffrSenior SI/PI Package Lead – 2.5D/3D ICs in austin at Unknown Company
This position is listed as full time and onsite.