Annapurna Labs, an organization within Amazon, is seeking a Sr. Signal & Power Integrity Engineer to drive SI/PI analysis for next-generation machine learning and data center ASIC packaging.
You will own the package-level SI/PI strategy, from architecture trade-offs to design closure, measurement, and validation. You will collaborate with ASIC, board, and packaging teams to optimize electrical performance and manufacturing yield across 2.5D/3D-IC packaging, while applying advanced EM/IR analysis
#J-18808-LjbffrSenior SI/PI Engineer — Advanced 2.5D/3D Packaging in cupertino at Unknown Company
This position is listed as full time and onsite.