NVIDIA Corporation in Santa Clara, CA is seeking a Senior Package Modeling Engineer within the Advanced Technology Group (ATG). You will perform FEA to assess stress and thermo-mechanical behavior of advanced semiconductor packaging, contributing to roadmaps and material choices while mentoring teammates.
The role requires a strong background in FEA tools and packaging architectures, with excellent problem-solving and communication skills to drive reliable builds and collaborations across groups.
#J-18808-LjbffrSenior Semiconductor Packaging Modeling Lead - Hybrid in santa clara at Unknown Company
This position is listed as full time and onsite.