A leader in AI technology is seeking a Senior Chiplet Physical Design Engineer in the United States. In this role, you will design and integrate chiplets into a System-in-Package (SiP) while collaborating with global teams. The ideal candidate will have over 10 years of experience in physical design, expertise with advanced nodes, and proficiency in Synopsys or Cadence tools. This position offers competitive compensation ranging from $100k to $500k based on experience and skills.
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