Amkor Technology, Inc. in Tempe, AZ is seeking a BU Product Management leader for Advanced Chiplets/FCBGA Packaging.
The role centers on program management, managing key customer accounts, and driving internal process development to support customers, offshore factories and supplier teams while qualifying and ramping chiplet/FCBGA products. The ideal candidate will partner with BU members to hit annual goals, promote packaging technologies to customers, translate requirements into manufacturing
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