A semiconductor technology company in Santa Rosa, CA is seeking a Lead Engineer to drive the development of next-generation System in Package (SiP) modules. Candidates should have a background in Mechanical Engineering or related fields and 2-5+ years of experience in semiconductor fabrication processes. The role demands strong leadership and communication skills, as well as expertise in manufacturing electromechanical assemblies. The salary range for this position is $126,930 to $211,550, with excellent benefits including flexible time off and tuition reimbursement.
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Senior Process Engineer - SiP & Advanced Packaging in santa rosa at Unknown Company
This position is listed as full time and onsite.