Senior Process Engineer | $160,000–$190,000 + Equity | Hybrid | San Diego, CA
A rapidly growing photonics technology company is developing next-generation optical products for AI, data centre and high-performance computing applications .
We’re looking for a Senior Process Engineer with strong hands-on experience in advanced packaging and manufacturing processes , particularly Flip Chip and Thermo-Compression Bonding (TCB) .
What you’ll be doing:
- Develop and optimise optoelectronic assembly processes
- Lead Flip Chip and TCB process development
- Support 2.5D/3D packaging integration
- Work with suppliers and manufacturing partners to scale processes
- Design and execute DOE to improve yield and performance
- Monitor process health, including yield and failure Pareto trends
- Develop SOWs and project plans for new process development
What we’re looking for:
- 5+ years' experience in manufacturing/process engineering
- Strong expertise in Flip Chip and Thermo-Compression Bonding
- Experience with 2.5D/3D packaging and reliability challenges
- Experience with DOE, Gage R&R and statistical analysis using JMP, Minitab or similar
- Experience with FMEA
- Understanding of optoelectronic devices and packaging reliability
- Knowledge of microelectronics/photonics packaging processes
- Bachelor's degree in Engineering, Physics or a related discipline
- Comfortable working in a fast-paced, high-growth environment
This is an opportunity to join an ambitious and growing technology business working on advanced products at the intersection of photonics, semiconductors and high-performance computing.
Location: San Diego, CA – Hybrid
Salary: $160,000–$190,000 + Equity + Full Benefits Package
Senior Process Engineer in san diego at Unknown Company
This position is listed as full time and hybrid.