Micron Technology, Inc. in Boise, Idaho, is seeking an experienced organizational leader to drive methodology improvements and apply AI/advanced analytics to accelerate development of its most advanced memory packaging technologies, including HBM and 3DS DRAM.
You will influence internal roadmaps, partner with R&D, suppliers, and manufacturing across programs, guiding end‑to‑end execution and multi‑domain decisions.
#J-18808-LjbffrSenior Process Development Lead, Advanced Packaging in boise at Unknown Company
This position is listed as full time and onsite.