Principal EDA Engineer, Electronic Design Automation, Texas Institute for Electronics
The University of Texas at Austin invites you to apply for the Principal EDA Engineer role at the Texas Institute for Electronics (TIE). TIE is a semiconductor foundry venture dedicated to 3D heterogeneous integration (3DHI), chiplet‑based architectures, and multi‑component microsystems.
Purpose
The Principal EDA Engineer will lead the hands‑on implementation of electronic design automation (EDA) solutions for TIE’s multi‑component and chiplet integration platforms. The role focuses on developing and optimizing design kits, simulation methodologies, and reference flows from concept to deployment, acting as a key technical contributor and innovator.
Responsibilities
- Design and optimize comprehensive Process Design Kits (PDKs) and Assembly Design Kits (ADKs) for TIE’s platforms, including modeling, verification, and enablement collateral.
- Collaborate with subcontractors to define Statements of Work (SoW), monitor milestone progress, and adjust deliverables and payables.
- Serve as a technical authority for EDA packaging workflows, bridging electrical, thermal, and mechanical simulation domains.
- Represent TIE in technical working groups, customer design reviews, and ecosystem partnerships.
- Coordinate cross‑functional collaboration with engineering, packaging design, product marketing, and major EDA vendors (Synopsys, Cadence, Ansys, Siemens).
- Develop and execute detailed program plans covering scope, schedules, risk mitigation, resource allocation, and customer communication.
- Create technical documentation and collateral, including user guides, reference flows, and onboarding materials.
- Monitor EDA market trends and competitive developments to guide tool integration and platform differentiation.
- Champion a culture of accountability and transparency across all program workstreams.
Required Qualifications
- BS in Electrical Engineering, Computer Engineering, or a related discipline.
- 8+ years of experience in EDA, semiconductor design enablement, or advanced packaging workflows.
- Deep technical expertise with Synopsys, Cadence, Ansys, or Siemens design flows for chiplet and 3DHI.
- Proven experience building and deploying packaged‑related PDKs/ADKs with cross‑domain modeling and simulation.
- Exceptional communication skills—able to simplify complex concepts and build trust with technical and business audiences.
- Experience in a startup‑style environment—energized by ambiguity, urgency, and ownership.
- Execution mindset—demonstrated progress across multiple initiatives without layered management.
- Authorized to work in the United States on a full‑time basis without sponsorship.
- Preferred to be located in Austin, Texas, with hybrid arrangements possible and subject to university review.
Preferred Qualifications
- MS or PhD in Electrical Engineering, Computer Engineering, or a related discipline.
- Proven program‑management experience with multiple stakeholder partners and clear milestone ownership.
- Experience working directly with subcontractors, vendors, and partners to define and hold teams accountable.
Salary Range
Industry‑competitive salary; specific range to be discussed during the interview process.
Working Conditions
- Typical office environment with potential for all weather, extreme temperatures, chemical fumes, electrical, mechanical hazards.
- Use of manual dexterity, repetitive keyboard use, climbing stairs/ladders, lifting up to 25 pounds.
Required Materials
- Resume/CV
- Three work references with contact information (at least one supervisor reference)
- Letter of interest
Equal Opportunity Employer
The University of Texas at Austin is an equal‑opportunity/affirmative action employer that complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status.
Location
Pickle Research Campus, Austin, Texas
Employment Type
Full‑time
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