Renesas Electronics Corporation in Tempe specializes in advanced power packaging solutions, including SiP/modules, flip-chip LGA, and multi-chip modules with substrates or embedded die/capacitors. The role focuses on designing interconnect methods, qualifying materials, and coordinating with OSAT/CM partners to ensure robust, scalable packaging for automotive, consumer, and industrial applications.
You will work with Product and Reliability teams to qualify new packages, implement DOE-driven
#J-18808-LjbffrSenior Power Packaging Engineer – SiP & WLP in tempe at Unknown Company
This position is listed as full time and onsite.