Renesas Electronics Corp. in Austin, TX is seeking an experienced packaging engineer to design and develop power SiP/modules, wafer-level and flip-chip packaging, and to qualify materials, processes, and subcontractors.
You will lead DOE studies with OSAT/CM partners, ensure process specs, and drive successful production ramps. The role requires 10–15 years of package development experience, strong analytical and presentation skills, and cross-functional collaboration across Product,
#J-18808-LjbffrSenior Power Packaging Engineer – SiP & Wafer-Level in austin at Unknown Company
This position is listed as contract and onsite.