Broadcom is seeking a seasoned design engineer with a strong background in physical layout to drive next-generation ASIC products. The role focuses on 2.5D and 3D interconnects, with collaboration across R&D, IP development, customers, and manufacturing partners.
The candidate will design and implement power grids, die-to-die interconnects, and high-speed interfaces, while automating processes and performing critical electrical analyses to ensure performance and manufacturability.
#J-18808-LjbffrSenior Physical Design Engineer — 3D/2.5D IC Interconnects in san jose at Unknown Company
This position is listed as full time and onsite.