Senior Photonics Engineer
General Dynamics Mission Systems designs, prototypes, packages, and tests custom photonic integrated circuit (PIC) and photonic subsystem solutions for mission-critical defense and intelligence applications.
We are seeking a Senior Photonics Engineer to lead photonic design execution across multiple programs and technology platforms. You will tackle a wide breadth of photonic and optoelectronic design challenges from integrated photonic circuits to optical communication systems to more complex and advanced systems.
Core Responsibilities:
- Lead the full PIC design cycle process: requirements analysis, component and circuit design, simulation, layout, foundry tape-out, post-fabrication test, and design iteration
- Design PIC circuits and components using foundry PDKs and first-principles approaches as needed
- Execute PIC layout using Luceda IPKISS or equivalent tools
- Perform photonic simulation using Lumerical, Tidy3D, Photonforge, or equivalent tools
- Manage tape-out with domestic foundries including design rule checks, foundry interface, and run coordination
- Lead testing and characterization activities for fabricated PIC devices optical and electrical measurements on bare die and packaged parts
- Design PICs with packaging in mind fiber coupling, electrical fanout (wirebond and flip-chip), thermal, and mechanical constraints
- Contribute to optical system and link-level design and trade studies where programs extend beyond the chip level
- Mentor junior engineers and team members
- Contribute to IRAD projects and technology development
- Participate in customer-facing technical discussions and design reviews
- Contribute to technical and cost proposals
We encourage you to apply if you have these skills and experiences:
- Bachelor’s degree in Electrical Engineering, Photonics, Applied Physics or other relevant field plus a minimum of 8 years of relevant experience OR Master’s degree plus a minimum of 6 years of relevant experience OR PhD degree plus a minimum of 3 years of relevant experience
- Experience with full-lifecycle PIC design: concept modeling tape-out test
- PIC layout tools (Luceda IPKISS, Photonforge, or equivalent)
- Photonic simulation tools (Lumerical, Tidy3D, or equivalent)
- Foundry tape-out experience at a commercial photonics foundry.
- Experience on at least one major photonics platform: silicon, silicon nitride, lithium niobate
- Working knowledge of core PIC building blocks: waveguides, couplers, ring resonators, AWGs, MZIs, modulators, photodetectors
- PIC test and characterization fiber-coupled and probe-based measurements
- Technical leadership or mentorship of small engineering teams
- Python or scripting for design automation or test
Nice to have:
- Post-fabrication packaging experience: fiber array attach, wirebond or flip-chip integration, optical alignment, or managing external packaging vendors
- Multi-platform PIC experience across two or more of: silicon photonics, silicon nitride, III-V (InP), thin-film lithium niobate (TFLN)
- Optical system-level design or systems engineering for communication or sensing systems
- Familiarity with active photonic devices (lasers and amplifiers) and their integration into PIC-based systems
- RF photonics or analog photonic link design
- Nonlinear photonics (microresonator frequency combs, four-wave mixing, stimulated Brillouin scattering)
What sets you apart:
- A track record of taking a PIC from concept through tape-out to packaged, tested hardware the complete journey, not just simulation or layout
- Multi-platform adaptability across different material systems and foundry processes
- Experience specifying packaging requirements and managing external assembly vendors to deliver integrated photonic modules
- Technical leadership on small design teams defining approach, distributing work, and delivering as a team
- Combined depth in PIC design and breadth in optical or RF system-level engineering you design the chip and understand the system it lives in
- Adjacent domain experience in free-space optical (FSO) communication systems, fiber-optic telecom systems, or RF systems.
- Ability to think creatively, multi-task, and communicate with internal and external stakeholders
- Identifies opportunities to apply AI for continuous improvement and innovation