Senior Packaging Reliability Engineer for AI/HPC Systems

OpenAI’s Hardware organization seeks a Package Reliability Engineer to lead reliability for advanced HPC packages, focusing on mechanical and thermal reliability. You will apply thermo‑mechanical modeling to optimize design, materials, and assembly processes, and develop test plans with external partners.

You will work across design, silicon, system engineering, manufacturing, and ASIC teams to predict behavior, identify failure modes, and drive corrective actions that enhance robustness and