Advanced Micro Devices, Inc. is seeking a senior leader to drive end-to-end execution of Data Center GPU and MI package design programs in a fast-paced environment. You will coordinate cross-functional teams, OSAT partners, and vendors to ensure design convergence, schedule adherence, and manufacturability.
The role emphasizes leadership, strategic decision-making, and the adoption of AI/ML-enabled tools to optimize design processes and productivity across geographies.
#J-18808-LjbffrSenior Packaging Engineering Lead — Data Center AI/Automation in austin at Unknown Company
This position is listed as full time and onsite.