Micron Technology in Boise, Idaho, is seeking a Package Development Engineer to drive silicon and package integration within the CPI team. You will partner with global engineering groups to deliver high-quality products and develop technical roadmaps.
You will use AI-enabled tools to enhance productivity, support reliability plans, and collaborate across multiple functions to resolve complex packaging challenges. A Bachelor’s degree and 5+ years of experience are required.
#J-18808-LjbffrSenior Package Silicon Integration Engineer in boise at Unknown Company
This position is listed as full time and onsite.