NVIDIA is seeking a Senior Package Modeling Engineer in the Advanced Technology Group (ATG) to advance semiconductor packaging reliability and performance. You will perform FEA to evaluate stress, warpage, and thermo-mechanical behavior across cutting-edge platforms and help shape material choices and process options.
The role requires a MS/PhD or equivalent, 5+ years of FEA experience, and expertise in ANSYS/Abaqus/COMSOL. A hybrid work arrangement and equity benefits are offered.
#J-18808-LjbffrSenior Package Modeling Engineer | Hybrid + Equity in santa clara at Unknown Company
This position is listed as full time and hybrid.