Micron Technology, Inc. in Boise, Idaho, seeks a Product Development Engineer 5 - Hardware Engineering MTS to lead package architecture initiatives and drive next-generation memory solutions.
You will partner with system architects, develop block diagrams and netlists, and support ASIC/package co-design, while advancing interfaces like PCIe, DDR, and LPDDR. This role offers a comprehensive benefits package and strong growth.
#J-18808-LjbffrSenior Package Engineer: ASIC & Memory Packaging Architect in boise at Unknown Company
This position is listed as full time and onsite.