Renesas is seeking a Staff Package Design Engineer to join the Advanced Silicon Packaging team in Austin, TX or Tempe, AZ. You will design and deliver high-performance semiconductor package solutions, including power modules and chiplet-based architectures for automotive, industrial, IoT, and AI-enabled platforms.
The role requires deep expertise in package layout, manufacturability, assembly constraints, and cross-domain co-design with global teams.
#J-18808-LjbffrSenior Package Design Engineer - Power & Chiplet Packages in tempe at Unknown Company
This position is listed as full time and onsite.