Touchdown Labs is seeking a Package Design & Substrate Engineer to drive substrate stack-up, routing, and thermal integrity for high-speed compute chips. You will work closely with chip, system, and supplier teams to ensure robust packaging and testability in a fast-paced environment.
The role requires 7+ years in package/substrate design, SI/PI and thermal simulation experience, and proficiency with Cadence APD/SiP or Ansys.
#J-18808-LjbffrSenior Package & Substrate Design Engineer in santa clara at Unknown Company
This position is listed as full time and onsite.